News
KYOCERA Presents SLC Wiring Boards and IC Packages
High Density Organic Flip chip Substrates
Kyoto / Neuss, 30 April 2010 - The Japanese technology company KYOCERA - one of the worldwide leading manufacturers of ceramic packages for the microelectronics industry - will present High Density Organic Flip Chip Substrates at the SMT show in Nuremberg from June 8th to June 10th (Hall 9 /Stand 9-241).